Institute of Chemical Technologies and Analytics | Christian Doppler Labor
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Module 1 - Structural integrety in miniaturized multilayered material systems

Multifunctional advanced electronics with a high packaging density are composed of a very broad range of dissimilar materials. Today the semiconductor industry is facing great challenges including concurrent increased functionality and downscaling together with extremely short product life cycles and the demand for global competitiveness. The integration of more multi-functional systems into the microelectronics requires further increase in packaging density by using a large variety of materials with different properties. Traditional testing methods applied in industry are not sufficient for reliability assessment of emerging semiconductor technologies. Since time factor plays a major role in development and implementation of new products to the market, new physic-based accelerated testing procedures are highly required.

The objective of our CD laboratory is establishment of novel experimental and theoretical methodologies for prediction of the onset and threshold of the damage and determination of the reliability and safety margins for current and novel semiconductor technologies and is accomplished within three work packages.

The results obtained within this CD-laboratory will lead to successful implementation of innovative material systems and complex structures with improved properties, reliability and lifetime in a broad application field of future microelectronics.

Application of the novel rapid assessment and qualification methods developed and applied within this research work will support the leadership of the participating industry by reducing the time to market of their emerging products.

Work package-F: Fatigue, degradation and cyclic delamination behaviour

The main objective is to study and to understand the micro-mechanism of deformation processes of multilayered electronic structures under various loading conditions with a special focus to fatigue related delamination behavior. This requires further development of novel accelerated testing procedures for determination of the fatigue response of multilayered microelectronics and identification of the critical sites in these systems in a reasonable timespan. Analysis of the corresponding failure mechanism at micro- and nano scale, lead to prediction and elimination of the sites of potential risk in devices.

Work package C: Microstructural and chemical characterization of interfaces and multilayers

The objective is detailed characterization and knowledge of the microstructural features of the interfaces and interlayers and the influence of internal stress in the multilayered systems during the stages of design, fabrication and operation. For this purpose advanced analytical characterization methods will be evaluated and applied. Failure analysis is required for determination and interpretation of the cause and micromechanisms of failure subsequent to loading requiring optical and chemical analysis of the delaminated surfaces.

Work package-M: Physical and mechanical properties

Selected material properties of the test structures will be determined with respect to the scale, constraint and environmental effects as input and for validation of numerical methods. The interfacial adhesion properties will be determined and compared with the fatigue data.