Institute of Chemical Technologies and Analytics | Christian Doppler Labor
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Publications

  • Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure, F. Saghaeian, M. Lederer, A. Hofer, J. Todt, J. Keckes, G. Khatibi, Int. Journal of Fatigue, 128 (2019) 105179
  • Comparative study of wire bond degradation under power and mechanical accelerated tests, V.N. Popok, S. Buhrkal-Donau, B. Czerny, G. Khatibi, H. Luo, F. Iannuzzo, K. B. Pedersen, J Mater Sci: Mater Electron (2019) 30: 17040.
  • I. Boturchuk, T. Walter, B. Julsgaard, G. Khatibi, S. Schwarz, M. Stöger-Pollach, K. Pedersen, V. N. Popok, Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaN, J Mater Sci: Mater Electron (2019) 30: 18144
  • On crack propagation in homogeneous and composite materials under mixed mode loading conditions, M. Lederer, A. Betzwar Kotas, G. Khatibi and H. Danninger, MSMF9, 9th Conference "Materials Structure & Micromechanics of Fracture" Brno, Czech Republic, June 26 - 28, 2019
  • New method for evaluating weld overlays exposed to combined wear and dynamic loads, G. Khatibi, M. Kirchgaßner, MSMF9, 9th Conference "Materials Structure & Micromechanics of Fracture" Brno, Czech Republic, June 26 - 28, 2019
  • Behavior of silver-sintered joints by cycling mechanical loading and influence of temperature, Z. Gökdeniz, G. Khatibi, J. Nicolics, EMPC, 22nd Microelectronics an Packaging Conference (EMPC) & Exhibition, 16th- 19th September, Pisa Italy
  • Versatile ultrasonic fatigue testing method with variable load ratio for small scaled samples, C. Gasser, B. Czerny, G. Khatibi, Innovation Messtechnik 2019 (6. Tagung), 16. Mai in Linz, Ars Electronica Center (AEC)
  • Accelerated mechanical fatigue interconnect testing method for electrical wire bonds, B. Czerny, G. Khatibi, Technisches Messen 85/4 (2018) 213-220
  • Characterization of cyclic delamination behavior of thin film multilayers, T. Walter, G. Khatibi, M. Steffeneli, M. Nelhiebel, Microelectronics, Reliability 88-90 (2018) 721-725
  • Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl, B. Czerny, G. Khatibi, Microelectronics Reliability 88-90 (2018) 745-751
  • BAMFIT – Accelerated Mechanical Fatigue Interconnect Test, B. Czerny, G. Khatibi, Plus Zeitschrift, 1(2018) 119-125
  • Balance of angular moments in structural mechanics of finite strains: A condition for second spatial derivatives of stress, M. Lederer, G. Khatibi, Journal of Physics: Conference Series (2018)
  • Temperature Dependent Mechanical Properties of Sintered Silver-Copper Joints, Z. Gökdeniz, G. Khatibi, T. Walter and J. Nicolics, 2018 41st International Spring Seminar on Electronics Technology (ISSE), Zlatibor, Serbia, (2018) 1-6. doi: 10.1109/ISSE.2018.8443659
  • Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module, M. Liedtke, G. Khatibi, B. Czerny and J. Nicolics, 2018 41st International Spring Seminar on Electronics Technology (ISSE), Zlatibor, Serbia, (2018)1-7. doi: 10.1109/ISSE.2018.8443619
  • Characterization of adhesion properties by delamination of ceramic-metal interfaces in four point bending, M. Lederer, A. Betzwar Kotas, G. Khatibi, H. Danninger, Key Eng. Materials 774 (2018) 66-71
  • Lifetime modelling of Cu and Au fine wire bonds, G. Khatibi, A. Mazloum Nedjadari, M. lederer, M. Delshadmanesh, B. Czerny, MATEC Web of Conferences (2018) 165, 06002
  • An advanced method for cyclic delamination studies of thin film multilayers in electronics, T. Walter, G. Khatibi, ESTC 2018, IEEE Proc. of Electron. Sys. Integ. Techn. Conf., Dresden Germany
  • Investigation on the lifetime of copper wire bonds in electronic packages under thermal and mechanical cyclic loading, A. Mazloum-Nejadari, M. Lederer, G. Khatibi, B. Czerny, L. Weiss, J. Nicolics, ESTC 2018, IEEE Proc. of Electron. Sys. Integ. Techn. Conf., Dresden Germany
  • Effect of aging on mechanical properties of high temperature Pb-rich solder joints, G. Khatibi, A. Betzwar Kotas, M. Lederer, Microelectronics Reliability 85 (2018) 1-11.
  • Accelerated mechanical fatigue interconnect testing method for electrical wire bonds, B. Czerny, G. Khatibi, Technisches Messen, 85/4 (2018) 213-220.
  • Wire bond degradation under thermo- and pure mechanical loading, K.B. Pedersen, D.A. Nielsen, B. Czerny, G. Khatibi, F. Iannuzzo, V.N. Popok, K. Pedersen, Microelectronics Reliability, 76-77(2017), 373-377
  • A delamination study on metallization stacks of power semiconductors, T. Walter, G. Khatibi, 2017 21st European Microelectronics and Packaging Conf. (EMPC) 1-7
  • Mechanical properties and life time of high Pb-containing solder joints, G. Khatibi, A. Betzwar Kotas, 2017 21st European Microelectronics and Packaging Conf. (EMPC) 1-6
  • Crystal plasticity modeling of the heat affected zone of copper micro-wires, A. Mazloum-Nejadari, M. Lederer, G. Khatibi, J. Nicolics, 2017 21st European Microelectronics and Packaging Conf. (EMPC) p 1-6
  • Isothermal bending fatigue response of solder joints in high power semiconductor test structures, A. Betzwar Kotas, G. Khatibi, Microelectronics Reliability 76-77(2017) 357-361
  • Reliability of Cu wire bonds in microelectronic packages, A. Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss, Microelectronics Reliability 74 (2017) 147-154.
  • High cycle fatigue testing of thermosonic ball bonds, A. Lassnig, M. Lederer, G. Khatibi, R. Pelzer, W. Robl, M. Nelhiebel, Microelectronics Reliability (2017) 71, 91-98.
  • On the influence of internal void size on the fracture stress of constrained solder joints, M. Lederer, G. Khatibi and J. Magnien, Solid State Phenomena, Materials Structure & Micromechanics of Fracture VIII, (2017) 229
  • Ultraschnelle Prüftechnik für die Zuverlässigkeitsanalyse von Drahtbondverbindungen in der Leistungselektronik, B. Czerny, G. Khatibi, Plus Zeitschrift,1(2017) 133-143
  • On the relation between the energy of a distorted crystal lattice and the bending modulus of strain gradient elasticity, M. Lederer, G. Khatibi, J. Phys.: Conf. Ser. (2017) 790 012019
  • Investigation of the stress distribution around a mode 1 crack with a novel strain gradient theory, M. Lederer, G. Khatibi, J. Phys.: Conf. Ser. (2017) 790 012018

  • Interface reliability and lifetime prediction of heavy aluminum wire bonds, Czerny, B., Khatibi, G., (2016) Microelectronics Reliability, 58, pp. 65-72. ,DOI: 10.1016/j.microrel.2015.11.028
  • Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stresses, E. Suhir, J. Nicolics, G. Khatibi, M. Lederer.  Journal of Materials Science: Materials in Electronics, 2016, Vol 27/9, p 9356-9362
  • Reliability of Cu Wirebonds in Microelectronic Packages, A. Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss, EuroSimE 2016
  • A novel approach for evaluation of material interfaces in electronics, Khatibi, G., Czerny, B., Lassnig, A., Lederer, M., Nicolics, J., Magnien, J., Suhir, E., (2016) IEEE Aerospace Conference Proceedings, 2016-June, art. no. 7500758, . DOI: 10.1109/AERO.2016.7500758

Talks

  • A. Betzwar Kotas, G. Khatibi, Isothermal bending fatigue response of solder joints in high power semiconductor test structures; ESREF 2017, Bordeaux , Sept 2017
  • A. Mazloum Nejadari, M. Lederer, G. Khatibi, J. Nicolics, Crystal plasticity modeling of the heat affected zone of copper micro-wires"; European Microelectronics and Packaging Conference 2017 (EMPC), Warsaw, Poland; 10.09.2017 - 13.09.2017
  • B. Czerny, "Accelerated Mechanical Fatigue Interconnect Testing Method for wire bonds in power modules"; "5. Tagung Innovation Messtechnik - Innovative Metrology",
  • G. Khatibi, A. Betzwar Kotas,Mechanical properties and life time of high Pb-containing solder joints";  The 2017 European Microelectronics and Packaging Conference (EMPC), Poland; 10.09.2017 - 13.09.2017
  • G. Khatibi, Alternative accelerated qualification methods for electronic component;  Chemisch-physikalischen Gesellschaft an der Universität Wien, (eingeladen); 20.06.2017.
  • G. Khatibi, A. Betzwar Kotas, B. Czerny, Degradation and mechanical fatigue in electronic components  28th Colloquium on Fatigue Mechanisms, Friedrich-Alexander-Universität Erlangen-Nürnberg; 19.07.2017 - 21.07.2017.
  • M. Lederer, G. Khatibi, "On the elastic deformation around holes, dislocations and cracks evaluated within a finite strain approach"; keynote : ic-rmm3, Hungarn; 02.10.2017 - 06.10.2017.
  • M. Lederer, G. Khatibi, Correction to crack opening mode shapes evaluated from local material rotations, 14th International Conference on Fracture (ICF 14), June 18-23, 2017, Rhodes, Greece
  • M. Lederer, A. Betzwar Kotas, G. Khatibi, H. Danninger, Determination of energy release rate during delamination of ceramic-metal interfaces in four point bending, 14th International Conference on Fracture (ICF 14), June 18-23, 2017, Rhodes, Greece
  • T. Walter, G. Khatibi, A delamination study on metallization stacks of power semiconductor, The 2017 European Microelectronics and Packaging Conference (EMPC), Poland; 10.09.2017 - 13.09.2017
  • J. Sedlmair, G. Khatibi, B. Czerny, "BAMFIT - Accelerated Lifetime Tests for Heavy Wire Bonds", Vortrag: The 2017 European Microelectronics and Packaging Conference (EMPC), Poland; 10.09.2017 - 13.09.2017.
  • J. Sedlmair, S. Schmitz, G. Khatibi, B. Czerny,BAMFIT - Beschleunigte Lebensdauertests für Dickdrahtbonds, IMAPS Herbstkonferenz 2017, Berlin; 19.10.2017 - 20.10.2017.
  • G. Khatibi, B. Czerny, A. Lassnig, M. Lederer, J. Nicolics, J., Magnien, E. Suhir,, Keynote:  A novel approach for evaluation of material interfaces in electronics, AeroConf 2016 IEEE Aerospace Conference, 05 Mar - 12 Mar 2016, Montana USA
  • B. Czerny, G. Khatibi, M. Zehetbauer, Influence of testing frequency on fatigue life of Al wire bonds, 27th Colloquium on Fatigue Mechanisms, 2016, Vienna, Austria
  • M. Lederer, M. Zehetbauer, Multiple slip in plasticity theory, 27th Colloquium on Fatigue Mechanisms, 2016, Vienna, Austria
  • Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L.Weiss, Reliability of Cu Wirebonds in Microelectronic Packages, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 Montpellier, France, April 17-20, 2016,
  • M. Lederer, G. Khatibi and J. Magnien, On the influence of internal void size on the fracture stress of constrained solder joints, MSMF8, Eight International Conference on Materials Structure & Micromechanics of Fracture Brno, Czech Republic June 27 - 29, 2016
  • G. Khatibi, Mechanical Reliability of Microelectronics, Summer School Villach, Grundlagen und Trends in der Mikroelektronik, 29. August– 2 September 2016
  • B. Czerny, A. Mazloum-Nejadari, G. Khatibi, M. Zehetbauer, Fatigue testing method for fine bond wires in an LQFP package, ESREF 2016 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis,September 19-22, 2016 Halle (Saale)
  • T. Walter, M. Lederer, G. Khatibi, Delamination of polyimide/Cu films under mixed mode loading, ESREF 2016 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis,September 19-22, 2016 Halle (Saale)
  • B. Czerny, G. Khatibi, A. Mazloum Nejadari., Reliability Analysis of fine and thick wire bonds, ECPE Work Shop on Thermal and Reliability Modelling, Nürnberg 30.11- 1.12.2016,
  • B. Czerny, Accelerated Mechanical Fatigue Interconnect Testing Method (AMFIT) for heavy wire bonds in power modules, Colloquium, 14-16 December 2016, Infineon Warstein
  • G. Khatibi: "Alternative accelerated qualification methods for electronic components"; Keynote: Corpe Symposium Aalborg Denmark, Aalborg Denmark; 18.11.2015.
  • E. Suhir, J. Nicolics, G. Khatibi, M. Lederer: "Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses"; Vortrag: International Conference on Materials, Processing and Products Engineering (MPPE), Leoben; 03.11.2015 - 05.11.2015; in: "Proceedings of MPPE 2015", (2015).
  • M. Lederer, G. Khatibi: "On the relation between the energy of a distorted crystal lattice and the bending modulus of strain gradient elasticity"; in: "The 2nd International Conference on Rheology and Modeling of Materials", Hungary, 2015, ISBN: 978-963-12-3463-3, S. 159.
  • M. Lederer, G. Khatibi: ", Investigation of the stress distribution around a mode 1 crack with a novel strain gradient theory"; The 2nd International Conference on Rheology and Modeling of Materials; IGREX Engineering Service Ltd, Hungary, 2015, ISBN: 978-963-12-3463-3, S. 159.